Evite domaj komen moun
May 06, 2025
Kontan:
Top domaj ak solisyon:
Tonb: Ranje pa diminye asimetri gwosè pad (1: 0 . 8 rapò pou 0402 rezistans).
Soude balling: Magazen keratin nan<30% humidity and pre-bake PCBs at 120°C for 2 hours.
Component Cracking: Sèvi ak ba-fòs (<1N) nozzles for fragile MEMS sensors.
RX Juki a -7Seri redwi tombstoning pa 50% ak kontwòl presyon adaptasyon .
Rekòmandasyon Zouti:
X-ray enspeksyon pou BGA anile analiz (sib<5% void area).
Pwochen: Mezi Warpage