Ki jan yo anpeche domaj tombstoning nan asanble SMT
Causes : Uneven pad heating (ΔT >5°C between pads). Incorrect stencil design (asymmetrical solder volume). Excessive placement offset (>30% nan Lajè Pad) . Solisyon: Pad Design: Ogmante soulajman tèmik sou pi gwo pad . kenbe rapò gwosè pad mwens pase oswa egal a 1: 1 . 5 pou konpozan pè. Reflow ...
Pwodwi Entwodiksyon
Kot:
Uneven pad heating (ΔT >5 degre ant kousinen) .
Design Stencil ki pa kòrèk (volim asimetri soude) .
Excessive placement offset (>30% nan lajè pad) .
Solisyon:
Pad Design:
Ogmante soulajman tèmik sou pi gwo pad .
Kenbe rapò gwosè pad mwens pase oswa egal a 1: 1 . 5 pou konpozan pè.
Reflow Profile:
Chofe pant<1.5°C/sec to balance temperature.
Tranpe tan 60-90 sec nan 150-180 degre .
Pwosesis kontwòl:
Sèvi ak 3D SPI pou verifye simetri depozisyon keratin .
Baj popilè: Ki jan yo anpeche domaj tonb nan asanble SMT, Lachin, manifaktirè, Swèd, faktori, Customized, wholesale, bon mache, pricist, pri ki ba, achte rabè
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