Tanperati pik ak kontwòl tan pou plon-gratis reflow
For SAC305 Alloy : Peak Temp : 240-250°C (260°C max for heavy boards). Time Above Liquidus (TAL) : 60-90 sec. Ramp-up Rate : 1.0-2.0°C/sec to prevent thermal shock. Failure Risks : Too High : PCB delamination (>260 degre) . Twò ba: jwenti frèt (tal<30 sec).
Pwodwi Entwodiksyon
Pou alyaj SAC305:
Peak temp: 240-250 degre (260 degre max pou tablo lou) .
Tan pi wo a Liquidus (TAL): 60-90 sec .
Ramp-up pousantaj: 1.0-2.0 degre /sec pou anpeche chòk tèmik .
Echèk risk:
Twò wo: PCB delamination (>260 degre) .
Twò ba: Jwenti frèt (TAL<30 sec).
Baj popilè: Peak tanperati ak kontwòl tan pou plon-gratis reflow, Lachin, manifaktirè, Swèd, faktori, Customized, en, bon mache, pricelist, pri ki ba, achte rabè
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