Pwodwi yo

Optimal paramèt: Ang: 45-60 degre (60 degre pou amann-pitch) . vitès: 20-50 mm/s (pi dousman pou ouvèti<0.2mm). Material : Stainless steel for lead-free pastes. Defect Correlation : Bleeding :...

Règ Design: Dyamèt Aperture: PIN Dyamèt + 0.2 Mm . Epesè: 0 . 15mm (asire 75% ranpli twou). Fòm: sikilè pou broch<1mm, square for larger pins. Validation : X-ray inspection for voiding <15%.

Karakteristik kle yo evalye: an tan reyèl siveyans: tanperati presizyon: ± 0 . 5 degre . Presizyon imidite: ± 3% rh . Alèt: SMS/Notifikasyon Imèl lè pi lwen pase 23 ± 3 degre oswa {{7} santye. Top...

Karakteristik kle yo evalye: an tan reyèl siveyans: tanperati presizyon: ± 0 . 5 degre . Presizyon imidite: ± 3% rh . Alèt: SMS/Notifikasyon Imèl lè pi lwen pase 23 ± 3 degre oswa {{7} santye. Top...

IPC Estanda: Klas 1/2: Mwens pase oswa egal a 25% zòn anile pou chak jwenti . klas 3 (medikal/aerospace): mwens pase oswa egal a 15% . Metòd rediksyon: seleksyon keratin: ba-anile Pass (e ....

Feeder Pre-loading: Prepare manjeur pwochen travay la pandan Kouran kouri . Quick-Change palèt Sistèm: Diminye PCB aparèy Ajisteman Tan pa 70%. Estandadize anbalaj: Sèvi ak 8mm/12mm kasèt pou tout...

For SAC305 Alloy : Peak Temp : 240-250°C (260°C max for heavy boards). Time Above Liquidus (TAL) : 60-90 sec. Ramp-up Rate : 1.0-2.0°C/sec to prevent thermal shock. Failure Risks : Too High : PCB...

Paramèt kle: zòn etap-up (eleman amann-pitch): epesè: 0 . 13mm (vs . Creole 0 . 1mm) . Aperture rediksyon: 5% pou anpeche soude soude. Zòn etap-desann (konektè/BGA): epesè: 0.08mm pou fè pou evite...

Causes : Uneven pad heating (ΔT >5°C between pads). Incorrect stencil design (asymmetrical solder volume). Excessive placement offset (>30% nan Lajè Pad) . Solisyon: Pad Design: Ogmante soulajman...

Beijing Huáwéi Guóchàng Teknoloji Elektwonik Ko ., Ltd {{1}

Beijing Huáwéi Guóchàng Teknoloji Elektwonik Ko ., Ltd {{1}

Beijing Huáwéi Guóchàng Teknoloji Elektwonik Ko ., Ltd {{1}